发明名称 PLASMA TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus preventing the lowering of exhaustion characteristics at the time of vacuum suction caused by particles adhering to the inner surface of a chamber and capable of shortening a tact time. SOLUTION: A lining plate 15 is applied to the inner surface of the chamber 1. The lining plate 15 has a smooth surface to which no roughening processing is applied. Plasma is generated in the chamber 1 and the surface of a printed circuit board 13 is etched by plasma to be cleaned. Particles generated by etching scatters to the circumference to adhere to the lining plate 15 but, since the lining plate 15 has the smooth surface, particles are hard to adhere and moisture is also hard to adhere. Accordingly, the lowering of exhaustion characteristics at the time of vacuum suction caused by particles is prevented and the tact time can be shortened.
申请公布号 JP2002018275(A) 申请公布日期 2002.01.22
申请号 JP20000204647 申请日期 2000.07.06
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 FURUKAWA RYOTA
分类号 H05H1/46;B01J19/08;H05K3/26 主分类号 H05H1/46
代理机构 代理人
主权项
地址