| 摘要 |
PROBLEM TO BE SOLVED: To reduce grinding damage left on a monocrystal by eliminating overload to a grinding tool in cylindrical grinding of the semiconductor monocrystal. SOLUTION: In the case of applying cylindrical grinding to a monocrystal ingot, the ingot is chucked by a loader and rotated to measure an eccentric quantity. A grinding quantity is determined by correcting the eccentric quantity, and a grinding-cutting quantity per one time is computed. A grinding tool is driven on the basis of the cutting quantity to carry out cylindrical grinding. As a result, the grinding damage of the semiconductor monocrystal ingot after grinding can be minimized, and the service life of the grinding tool is lengthened. The appropriate cutting quantity corresponding to the monocrystal is obtained from the diameter of material and a discrepancy between a material crystal axis and a rotary shaft of a grinding machine. The eccentric quantity is added to the diameter to compute the cutting quantity when grinding. The cutting quantities of plural times are computed to reduce load each time.
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