发明名称 Means and process for encapsulating electric circuits by means of injection molding
摘要 A means and a process for protecting an electric circuit from ambient influences, the circuit being surrounded with a thermoplastic polymer which is applied by injection molding, the thermoplastic polymer comprising oriented macromolecules. The components of the circuit are aligned with their axis most sensitive to alternating tensile loading on average parallel to the respective direction of flow of the injected polymer in the vicinity of the components.
申请公布号 US6340791(B1) 申请公布日期 2002.01.22
申请号 US19990379473 申请日期 1999.08.23
申请人 MANNESMANN VDO AG 发明人 STOTZ OLIVER
分类号 B29C45/00;B29C45/14;H05K3/28;(IPC1-7):H02G3/08 主分类号 B29C45/00
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