| 摘要 |
PROBLEM TO BE SOLVED: To provide a notch grinding device that prevents a streak from easily breaking a semiconductor wafer in the crystal direction in chamfering the wafer, and the semiconductor wafer having a notch groove hardly developing a crack. SOLUTION: This notch grinding device comprises a disk-like grinding wheel 5 rotatably supported on a grinding wheel block 40, a work support block 57 for holding the semiconductor wafer 1 in a face obliquely crossing the plate surface of the grinding wheel 5, an Y-axis feed mechanism 20 for relatively moving the grinding wheel 5 in the Y-axis direction for allowing the grinding wheel 5 to approach to or separate from the wafer 1 on a plane parallel with the plate surface of the wafer 1, the X-axis feed mechanism 30 for relatively moving the grinding wheel 5 in the X-axis direction crossing Y-axis direction on the plane parallel with the plate surface of the wafer 1, and a lifting mechanism 50 for relatively moving the grinding wheel 5 in the Z-axis direction crossing the plate surface of the wafer 1. The grinding wheel 5 and the wafer 1 are relatively moved in three directions, and the notch groove 3 in the wafer 1 is chamfered.
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