发明名称 |
Composite wiring board and manufacturing method thereof |
摘要 |
There is provided a composite wiring board that occupies a small space and is low in price and a manufacturing method thereof; the composite wiring board comprises at least two rigid wiring boards on end faces of which connection portions are formed, in which each of the rigid wiring boards is arranged so that each of the connection portions is situated on a plane and each of corresponding connection portions is connected with each other in the plane. |
申请公布号 |
US2002006503(A1) |
申请公布日期 |
2002.01.17 |
申请号 |
US20010855771 |
申请日期 |
2001.05.16 |
申请人 |
WATANABE YOSHIO;TAKEBE TORU;KOSEMURA MAYUMI |
发明人 |
WATANABE YOSHIO;TAKEBE TORU;KOSEMURA MAYUMI |
分类号 |
H05K1/11;H01L23/498;H05K1/14;H05K3/00;H05K3/32;H05K3/36;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):B32B3/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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