CARRIER-FOILED COPPER FOIL CIRCUIT, PRINTED CIRCUIT BOARD MANUFACTURING METHOD USING THE CIRCUIT, AND PRINTED CIRCUIT BOARD

摘要

A material and a method for manufacturing a printed circuit board at a drastically low cost to supply a less expensive printed circuit board. A method for manufacturing a printed circuit board characterized by comprising the steps of using a carrier-foiled copper foil circuit characterized by having an organic joint interface between a carrier foil and a copper foil circuit layer, hot-pressing the carrier-foiled copper foil circuit and a prepreg for forming a resin substrate with the copper foil circuit formed face contacting with the prepreg to prepare a copper-clad laminated board, and peeling off the carrier foil from the outer layer of the copper-clad laminated board.