Aluminum silicon carbide and copper clad material and manufacturing process

摘要

A ceramic metal matrix composite and copper material having a layer of ceramic metal matrix composite such as aluminum silicon carbide (Al-SiC) bonded to a layer of metal such as copper useful for forming heat-dissipating components for microelectronics concerned with lightweight, high stiffness, high thermal conductivity and compatible thermo expansion characteristics. The clad material may be formed from plurality of sucessive layers of composite and metal. The material is formed by rolling an extruded strip of Al-SiC with the metal layer. Alternately, an interim layer of aluminum, aluminum silicon or other bond-enhancing material is clad to the metal layer prior to rolling it with the composite. The interim layer is thought to form a stronger bond with the exposed aluminum matrix portion of the composites layer.