Method for mounting and demounting semiconductor plates, e.g. for polishing, involves forming easily breakable joint using filler-containing resin-based cement with temperature-dependent adhesive-brittle properties

摘要

A method for mounting and demounting semiconductor plates by forming a temperature-dependent adhesive/brittle joint between the plate and a baseplate with the aid of a rosin-based mixture and then breaking the joint after processing the plate, in which the mixture also contains filler(s) and the embrittled joint is broken with water. An Independent claim is also included for a mixture of: (A) chemically-modified, esterified resin; (B) a saponifying amine of formula (1) with a boiling point of more than 150 deg C at 1000 hPa; and (C) filler and water. NR3 (1) R = H or optionally substituted hydrocarbyl, with the proviso that at least one group R is the residue of an aliphatic alcohol.