发明名称 |
FLEXIBLE LAMINATE FOR FLEXIBLE CIRCUIT |
摘要 |
<p>Method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper on a first side of a generally continuous strip of polyimide having a layer of metal on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a preformed adhesive film on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.</p> |
申请公布号 |
EP1171301(A1) |
申请公布日期 |
2002.01.16 |
申请号 |
EP19990966525 |
申请日期 |
1999.12.20 |
申请人 |
GA-TEK INC., D.B.A. GOULD ELECTRONICS INC. |
发明人 |
CENTANNI, MICHAEL, A.;KUSNER, MARK |
分类号 |
B32B15/08;B32B15/088;B32B27/00;C23C14/20;H05K3/00;H05K3/38;(IPC1-7):B32B31/24;H01B5/14 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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