发明名称 |
POLISHING PAD AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad having hydrophilic nature and durability and used in a CMP improved in maintenance of polishing slurry on a pad surface. SOLUTION: A sheet formed of hydrophilic fibers is caused to carry 20-90 wt.% hydrophilic high molecules. |
申请公布号 |
JP2002011652(A) |
申请公布日期 |
2002.01.15 |
申请号 |
JP20000192497 |
申请日期 |
2000.06.27 |
申请人 |
RENGO CO LTD;ROKI TECHNO CO LTD;ACE:KK |
发明人 |
HIGASHIYAMA SATORU;MURAMOTO TEI;SAITO HIDENAO;TOMINAGA SHIGERU;TAIRA TETSUJI |
分类号 |
B24B37/20;B24B37/24;H01L21/304 |
主分类号 |
B24B37/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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