发明名称 POLISHING PAD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a polishing pad having hydrophilic nature and durability and used in a CMP improved in maintenance of polishing slurry on a pad surface. SOLUTION: A sheet formed of hydrophilic fibers is caused to carry 20-90 wt.% hydrophilic high molecules.
申请公布号 JP2002011652(A) 申请公布日期 2002.01.15
申请号 JP20000192497 申请日期 2000.06.27
申请人 RENGO CO LTD;ROKI TECHNO CO LTD;ACE:KK 发明人 HIGASHIYAMA SATORU;MURAMOTO TEI;SAITO HIDENAO;TOMINAGA SHIGERU;TAIRA TETSUJI
分类号 B24B37/20;B24B37/24;H01L21/304 主分类号 B24B37/20
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