| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for plating a columnar protrusion in an integrated circuit substrate. SOLUTION: This method comprises, (1) plating a copper-wire circuit 12 on a top plate 11 of a substrate 1 by a prior art (for example, a metal plating method), (2) coating one junction shielding layer 13 on the top plate 11, the height (thickness) of which is just the same as that necessary to the following columnar protrusion 17, (3) opening an aperture 14 in an opposite position to the copper wire circuit of the junction shielding layer 13, (4) plating pure copper 15 on the copper wire circuit 12 by a metal plating technique, to make the pure copper 15 columnar at a location of the aperture 14, (5) plating another one metal layer of a tin-lead alloy 16 for welding on the top of the columnar pure copper 15, to make the height of the same as that of the junction shielding layer 13, and (6) removing the junction shielding layer 13 to leave the columnar protrusion. Thus, the columnar protrusion 17 is flip-chip bonded with a die. Because the height is increased with the plated pure copper 15 and the thickness is extremely suitable, a precision level can be enhanced. |
