发明名称 SOLID-STATE IMAGE PICKUP ELEMENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a solid-state image pickup element in which an optical resin protection film having a function of preventing adhesion of dust or the like to its microlenses is formed. SOLUTION: In this manufacturing method, by applying a coating material consisting of solution of an organic solvent, polymethyl methacrylate, using a rotary coating method, microlenses 12 and wirings are buried under a protection film 13 composed of polymethyl methacrylate, and simultaneously the surface of the protection film 13 is finished flatly. In this solid-state image pickup element, (1) dust seldom adheres to the surface of the microlenses, (2) even if dust adheres to the surface of a chip 21, dust can easily be removed by air blow A without gwing any damages to the surface of the chip, (3) even if scratched are given to the surface of the chip, wirings will not be damaged anymore, and (4) since the refractive index of the protection film 13 is very small, intended functions of the solid-state image pickup element can be secured.
申请公布号 JP2002009266(A) 申请公布日期 2002.01.11
申请号 JP20000188798 申请日期 2000.06.23
申请人 SONY CORP 发明人 MIYAZAKI SATOYUKI
分类号 G02B3/00;H01L21/312;H01L27/14;H04N5/335;H04N5/369;H04N5/372;(IPC1-7):H01L27/14 主分类号 G02B3/00
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