INTEGRATED INDUCTION CIRCUIT

摘要

PROBLEM TO BE SOLVED: To form the device of a radio frequency in the die of the same integrated circuit by using a CMOS manufacturing process wholly. SOLUTION: An integrated induction element (40a) is formed on a board (42). In order to reduce loss due to eddy current generated from electromagnetic coupling for the same integrated circuit between integrated inductors, various shaped trenches (80) can be defined in the board (42) of the lower side of the integrated induction element (40a).