| 摘要 |
<p>PROBLEM TO BE SOLVED: To secure radiation of heat for preventing scissioning from occurring in the internal layer of a substrate depending on a part terminal pitch, and to prevent decrease in connectivity in a printed-wiring board device having a through hole with a short pitch. SOLUTION: In a printed-wiring board device 1 where a plurality of through holes 2 passing through a multilayer printed circuit board 10 are formed, a thermal land 3 is formed merely around a through hole 23 in the outer-periphery of a crowded group 20 of the through holes on a printed circuit board of one portion of a connector, and no thermal land 3 is not formed around the through hole 22 in the inner site of the crowded group 20 of through holes.</p> |
