发明名称 Grinding process involves capturing large area very small particles in secondary sifting circuit from particle flow in primary circuit by setting flow speed difference at pressure stage
摘要 Process involves classifying material processed by a reduction device into coarser and finer fractions and recirculating the coarser fraction for re-processing in the device. By setting a flow speed difference at a pressure stage between primary and secondary sifting circuits, large area, especially flake-like, very small particles are captured in the secondary circuit from the particle flow in the primary circuit and separated out separately. The process involves classifying the material processed by a reduction device (10) into coarser and finer fractions of a particle-laden carrier gas flow in a primary sifting circuit (P) according to specific weight and/or form and recirculating the coarser fraction for re-processing in the reduction device. A secondary sifting circuit (S) branches off the primary sifting circuit. By setting a flow speed difference at a pressure stage (5-7) between the primary and secondary circuits, large area, especially flake-like, very small particles are captured in the secondary circuit from the particle flow in the primary circuit and separated out separately. Independent claims are also included for the following: a system for carrying out the process.
申请公布号 DE10030800(A1) 申请公布日期 2002.01.10
申请号 DE20001030800 申请日期 2000.06.29
申请人 ZOZ GMBH 发明人 ZOZ, HENNING
分类号 B02C23/14;B07B9/02;(IPC1-7):B02C23/10;B02C23/12;B07B7/08 主分类号 B02C23/14
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