| 摘要 |
The present invention provides exemplary cluster tool systems and methods for processing wafers, including for grind polishing wafers to remove grind marks. In one embodiment, a substrate processing system includes a first platen (912) having a first platen surface adapted for mounting a substrate (920) thereto, and a second platen (910) having an annular ring (916) coupled thereto. The annular ring includes a grinding surface, and the first platen is offset from the second platen to position a portion of the annular ring proximate a center of the substrate. The system further includes a controller (950) coupled to the platens to facilitate operation thereof. In this manner, the substrate processing system is configured to use an abrasive grinding process for the removal of grind patterns previously disposed in the substrate surface.
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