| 摘要 |
<p>A work piece carrier head (20) for a CMP or other polishing apparatus is configured to eliminate the slow band associated with the polishing of the surface of a work piece (30). The carrier head (20) includes a wear ring (28) that is positioned circumferentially about the work piece (30) and that together with the work piece (30) is pressed against a moving polishing pad (40). The wear ring (28) is resiliently coupled (32) to the body (22) of the carrier head (20) in a manner to avoid any overturning moment on the ring (28) caused by the frictional force of the polishing pad (40) against the wear ring (28).</p> |
