| 摘要 |
PURPOSE: A wafer level package is provided to remove a crack phenomenon of a solder ball by preventing a thermal stress applied from an insulating layer. CONSTITUTION: A multitude of bond pad(40) is formed on a surface of a semiconductor chip. A lower insulating layer is formed the surface of the semiconductor chip in order to expose the bond pads(40). A multitude of metal pattern is deposited on the lower insulating layer. End portions of each metal pattern is connected with each bond pad(40). An upper insulating layer(20) is formed on the lower insulating layer. The upper insulating layer has a via hole(21) for exposing the whole surface of each ball land(10) of the metal pattern and the lower insulating layer. A size of solder ball corresponds to a size of the ball land(10). The solder ball is mounted on the ball land(10).
|
