| 摘要 |
<p>The mounting of semiconductor chips (1) onto a flexible substrate (2) takes place in three steps: Firstly, at a dispensing station (3), adhesive (4) is applied to predetermined substrate sites (5) on the substrate (2). Then, at a bonding station (6), semiconductor chips (1) are placed onto the substrate sites (5). Finally, curing of the adhesive (4) takes place. In accordance with the invention, the substrate (2) is fixed onto a level support surface (10) by means of vacuum during the hardening of the adhesive (4). <IMAGE></p> |
