发明名称 |
Method for forming a resin molding for a coil of a transformer |
摘要 |
A method for forming a resin molding on a coil of a transformer is disclosed. The method comprises the steps of inserting a coil into an auxiliary spacing apparatus, inserting the auxiliary spacing apparatus into a mold, and forming a resin molding for the auxiliary spacing apparatus with the coil by putting a resin into the mold. According to the methods, the coil is not damaged and a resin molding is formed with an uniform thickness.
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申请公布号 |
US6334972(B1) |
申请公布日期 |
2002.01.01 |
申请号 |
US20000616976 |
申请日期 |
2000.07.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM CHEOL-JIN |
分类号 |
B29C45/14;B29C33/12;B29C45/16;B29K105/22;B29L31/34;H01F27/32;H01F30/00;H01F41/04;H01F41/12;H05B6/66;(IPC1-7):B29C45/14;B29C70/70 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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