发明名称 Method for forming a resin molding for a coil of a transformer
摘要 A method for forming a resin molding on a coil of a transformer is disclosed. The method comprises the steps of inserting a coil into an auxiliary spacing apparatus, inserting the auxiliary spacing apparatus into a mold, and forming a resin molding for the auxiliary spacing apparatus with the coil by putting a resin into the mold. According to the methods, the coil is not damaged and a resin molding is formed with an uniform thickness.
申请公布号 US6334972(B1) 申请公布日期 2002.01.01
申请号 US20000616976 申请日期 2000.07.14
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM CHEOL-JIN
分类号 B29C45/14;B29C33/12;B29C45/16;B29K105/22;B29L31/34;H01F27/32;H01F30/00;H01F41/04;H01F41/12;H05B6/66;(IPC1-7):B29C45/14;B29C70/70 主分类号 B29C45/14
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