| 摘要 |
A semiconductor device comprising a flexible substrate having an interconnecting pattern, an anisotropic conductive material arranged on a surface of the flexible substrate on which the interconnecting pattern is provided, a semiconductor chip provided with electrodes connected to the interconnecting pattern through the anisotropic conductive material, and a support member which is applied to the flexible substrate and secures the flatness. The anisotropic conductive material is provided so as to extend outside the semiconductor chip, and the support member is bonded to the flexible substrate via the anisotropic conductive material. |
