发明名称 |
Semiconductor device and manufacturing method thereof |
摘要 |
A semiconductor device capable of preventing diffusion of a particle of copper or the like which forms a conductive layer is provided without any increase in the number of manufacturing the steps. Further, a semiconductor device preventing diffusion of a particle forming a conductive layer into an insulating layer even when a width of the conductive layer is increased is provided. The semiconductor device includes: an insulating layer 2; a barrier layer 4; a conductive layer 5; a barrier layer 6 having an opening 11; an insulating layer 7 having a through hole 8 exposing a surface of conductive layer 5 and a part of a surface of barrier layer 6; a barrier layer 9 formed on a surface of said through hole 8 and insulating layer 7 which is in contact with an upper surface 6a of barrier layer 6; and a conductive layer 10 filling opening 11 and through hole 8.
|
申请公布号 |
US6335570(B2) |
申请公布日期 |
2002.01.01 |
申请号 |
US19990293784 |
申请日期 |
1999.04.20 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
MORI TAKESHI;TOYODA YOSHIHIKO;FUKADA TETSUO;KITAZAWA YOSHIYUKI |
分类号 |
H01L21/768;H01L23/532;(IPC1-7):H01L23/48;H01L23/52 |
主分类号 |
H01L21/768 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|