PLANARIZED PLASTIC MODULES FOR INTEGRATED CIRCUITS

摘要

A semiconductor module includes a semiconductor chip, a lead frame having le ad fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.