DIE BONDING DEVICE

摘要

A die bonding device (1) for mounting an electronic part (S) on a part mounting surface (27) installed on the stem base (24) of a metal stem (2), comprising a bonding nozzle (17) sucking the electronic part (S) and placing the electronic part (S) on the part mounting surface (27) of the stem (2), a stem mounting head (6) for mounting the stem (2) thereon, a heater part (9) heating the electronic part (S) in the state of being placed on the part mounting surface (27) of the stem (2), a stem base storing recessed part (9a) provided in the heater part (9) and storing the stem base (24) of the stem (2), a positioning surface (60) provided on a wall surface forming the stem base storing recessed part (9a) and pressed by the peripheral surface (24a) of the stem base (24), and a movable part (50) moving toward the positioning surface (60) and pressing the peripheral surface (24a) of the stem base (24) by the tip thereof so as to press the peripheral surface (24a) of the stem base (24) against the positioning surface (60).