发明名称 Solid-state pickup element and method for producing the same
摘要 The invention relates to a solid-state pickup element that can achieve both improvement in the sensitivity and reduction of pixel size and a method for producing the same, wherein a solid-state pickup element 1 is constructed, which includes a first conductive type semiconductor area 21, which is formed at least so as to include the inside of the semiconductor substrate 2 upward of the overflow barrier area 3 inside the semiconductor substrate 2, and a charge accumulating area 6 at the position corresponding to the first conductive type semiconductor area 21 of the light receptive sensor part 5 in the epitaxial layer 4 on the semiconductor substrate 2. Also, an overflow barrier area 3 is formed in the semiconductor substrate 2, and the first conductive type semiconductor area 21 is formed on the surface, respectively, wherein an epitaxial layer 3 is formed on the semiconductor substrate 2, and a charge accumulating area 6 is formed at the position corresponding to the first conductive type semiconductor area 21 on the surface side of the epitaxial layer 3, thereby producing a solid-state pickup element 1.
申请公布号 US2001054726(A1) 申请公布日期 2001.12.27
申请号 US20010826144 申请日期 2001.04.04
申请人 ABE HIDESHI 发明人 ABE HIDESHI
分类号 H01L27/146;H01L27/148;H04N5/335;H04N5/369;H04N5/372;(IPC1-7):H01L31/062;H01L31/113;H01L21/00 主分类号 H01L27/146
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