MOUNTING STRUCTURE OF SEMICONDUCTOR DIE

摘要

PROBLEM TO BE SOLVED: To provide a mounting structure of a semiconductor die in which the area of a supporting board required for a plurality of semiconductor devices is reduced and the number of parts and the assembling cost can be reduced in such a power converter or other power subsystem for high density use. SOLUTION: An SO-8 type package comprises a control MOSFET die mounted on one lead frame section, and a synchronous rectifier die comprising a synchronous MOSFET die and a Schottky diode die mounted on a second lead frame pad section. The dies are interconnected through lead frame pads and wire bonds in order to section a back converter circuit. The dies and the lead frame pads are mounted while being covered with a common insulator housing.