| 摘要 |
PROBLEM TO BE SOLVED: To prevent upper layer pads from peeling off or a layer insulation film, which lies under the pads form cracks against stresses in probing or wire bonding for improving the reliability of a semiconductor device. SOLUTION: A lower layer conducive pad 2 is formed n a layer insulation film 1, an upper layer conductive pad 4 is formed via a layer insulation film 3 on the pad 2, the upper and lower layer conductive pads are connected via a plurality of conductive plugs 5. The plugs 5 are disposed alternately with minimum or near minimum spacing, according to the design standards so as not to array in line, in a direction perpendicular to the pressure-applying direction in probing/wire bonding. Consequently, such a constitution disperses stresses in probing or wire bonding to avoid cracks, without sacrificing the adhesion of the pads.
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