| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for mounting a semiconductor device, by which various components can be mounted on a circuit board for mounting, at such temperature that the reliability of all the components does not deteriorate. SOLUTION: On a motherboard 11, various electronic components, semiconductor packages, etc., are mounted to constitute an integrated circuit. At this time, external terminals TML of a chip resistance element 12, a chip capacitor 13, various IC packages 14 to 16, etc., are connected to terminals of corresponding conduction patterns PTN on the side of the motherboard 11 through an anisotropic conductive film ACF.</p> |
