Semiconductor wafer aligning system and method using same

摘要

A semiconductor wafer aligning system includes a table having a spray opening for upwardly spraying fluid to form a fluid surface on which a semiconductor wafer floats. A guide disposed on the table contacts the wafer at a circumferential edge to guide the wafer to a correct location. Thus, a wafer is aligned without generating particles that hinder semiconductor fabrication, and without directly scratching a front side during back side grinding.