发明名称 Micro fusible link for semiconductor devices and method of manufacture
摘要 An electrically activated fuse with a high melting point heater element in series with a low melting point fusible link. The heater element has a higher resistivity and larger cross-sectional area than the fusible link in order to withstand heat that the heater element generates bringing the fusible link to its melting point. Fuse dimensions (width and length) are each between 0.1 and 2.0 microns, with a thermal mass of the heater element being sufficient to melt the fusible link.
申请公布号 US6333546(B1) 申请公布日期 2001.12.25
申请号 US20000692539 申请日期 2000.10.20
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 MARMILLION PATRICIA;PALAGONIA ANTHONY M.;SCHMIDT DENNIS A.
分类号 H01L23/525;(IPC1-7):H01L29/00 主分类号 H01L23/525
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