| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for depositing an electroless plating film by which the deposition process of an electroless plating film is simplified, and also, the danger, e.g. of treating virulent poison is not accompanied at the time of the deposition. SOLUTION: After mixed hydroxide colloids 31 having a plurality of metallic hydroxides are adhered to a prescribed member 30, an electroless plating solution is fed to the above member. |
