Semiconductor integrated circuit device equipped with power make-up circuit used in burn-in test after packaging and method for testing the same

摘要

There is a possibility that user brings a semiconductor dynamic random access memory device to a burn- in test after packaging, and a power transfer circuit is connected between an external pin and an internal power supply line, wherein the power transfer circuit discriminates an external high power voltage from other lower voltages so as connect the external pin to the internal power supply line, thereby allowing the user to carry out the burn-in test at a high speed.