| 摘要 |
An alkoxysilane/organic polymer composition for the production of thin insulating films which comprises (A) a specific alkoxysilane, (B) a specific organic polymer, and (C) a solvent which is for the alkoxysilane (A) and the organic polymer (B) and comprises an organic solvent having an amide group and/or an ester group; a thin insulating film of a silica/organic polymer composite obtained by forming the composition into a thin film, subjecting the alkoxysilane in the thin film to hydrolysis and condensation with dehydration to cause the alkoxysilane to gel, and removing the solvent remaining in the film; and a thin porous silica film obtained from the thin composite film by removing the organic polymer therefrom. The two films not only have a low permittivity and are suitable for use as an insulating layer for a multilayer wiring structure of a semiconductor element, but also can be produced by a method easily practicable in current semiconductor element production processes. |
