| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-layer printed wiring board which can be directly and electrically connected to an IC chip without using any lead component. SOLUTION: In this multi-layer printed wiring board, an IC chip 20 is preliminarily incorporated in a core board 30. A transition layer constituted of a first thin film layer 33, a second thin layer 36, and a thick film 37 is arranged on a die pad 24 of the IC chip 20. Thus, it is possible to electrically connect the IC chip to the multi-layer printed wiring board without using any lead component or sealing resin. Also, it is possible to prevent any resin on the die pad 24 from being left by providing a three-layer transition layer 38 on the die pad 24, and to improve the connecting performance and reliability of the die pad 24 and via hole 60. |
