发明名称 WIRING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring circuit board for reliably preventing the short- circuiting between a metal terminal layer and a metal support layer and for improving connection reliability and voltage resistance characteristics with a simple configuration. SOLUTION: In this wiring circuit board, a base layer 13 is formed on a support substrate 12, a conductor layer 14 is formed on the base layer 13, the support substrate 12 and the base layer 13 are opened to expose the surface of the conductor layer 14, and a metal-plated layer 19 is formed on the surface of the conductor layer 14 being exposed at an opening part 34 of the support substrate 12 and an opening part 35 of the base layer 13. A specified gap is provided between the peripheral edge of the metal-plated layer 19 and that of the opening part 34 in the wiring circuit board.
申请公布号 JP2001352137(A) 申请公布日期 2001.12.21
申请号 JP20000172034 申请日期 2000.06.08
申请人 NITTO DENKO CORP 发明人 YAMATO TAKESHI;ITO KENICHIRO
分类号 G11B5/60;G11B5/48;G11B21/21;H05K1/05;H05K3/00;H05K3/06;H05K3/10;H05K3/38;H05K3/40;H05K3/44;(IPC1-7):H05K1/05 主分类号 G11B5/60
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