| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device, in which the occur rence of disconnections in the junction interfaces between junctions and IC electrode sections and between the junctions and substrate electrode sections is reduced by reinforcing the jointing strengths between the junctions and elec trode sections in the interfaces. SOLUTION: This semiconductor device is provided with a semiconductor IC chip section carrying a plurality of IC electrode sections on one surface, a mounting substrate section carrying a plurality of substrate electrode sections on one surface, and a plurality of junctions which join the IC electrode sections to their corresponding substrate electrode sections, the IC electrode sections have first projecting sections, which are fixed to the electrode sections and protruded into the junctions and the substrate electrode sections have second projecting sections, which are fixed to the electrode sections and protruded into the junctions so that the reliability of the semiconductor device is improved. |
