| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic circuit substrate in which in increasing the density of the ceramic circuit substrate, a high density pattern by a thick film intaglio transfer method is formed as an inner packaging conductor. SOLUTION: In a method for forming a conductor pattern on an un-baked green sheet by use of a thick film intaglio transfer method, a heat-resistant substrate is coated with adhesives, and first the conductor pattern is tentatively transferred to the heat-resistant substrate, the un-baked green sheet is disposed adjacent to the intaglio-transferred conductor pattern of the heat-resistant substrate, and the conductor pattern is retransferred so as to cut into the unbaked green sheet in a heating and compressing process step. Thus, a thick film intaglio pattern can be formed on an unbaked ceramic GS. This is debindered and sintered, thereby manufacturing a ceramic circuit substrate in which a high performance conductor pattern by the thick film intaglio transfer method is formed as an inner packaging conductor. |
