摘要 |
<p>An electronic device capable of being connected, with high reliability, to a conventional circuit board using Pb-free solder as the substitute of Sn-37Pb solder, wherein solder paste (4) is fed onto the inner side of the wiring pattern (3) on the circuit board (1) in V-shape, recessed-shape, or projected-shape, and the solder paste is connected to a semiconductor device (2), whereby the electronic device with high reliability of connection can be provided.</p> |