| 摘要 |
An apparatus to dispense a droplet of liquid, such as solder flux, onto the surface of a substrate, such as a printed circuit board, and thereafter flatten the droplet with a burst of pressurized air directed onto the droplet. A dispenser has a dispenser body, which has a liquid supply passageway adapted to connect to a source of liquid. A nozzle body connects to the dispenser body and includes a liquid discharge passageway in fluid communication with the liquid supply passageway. The nozzle body also has an air discharge orifice which is adapted to connect to a source of pressurized air for selectively discharging bursts of pressurized air. The air discharge orifice is configured and aligned with the liquid discharge passageway so that the discharged bursts of pressurized air impinge upon one of the droplets of liquid dispensed from the liquid discharge passageway so as to flatten that droplet and thereby increase the contact area between the droplet and the substrate.
|
