<p>A sensing apparatus for sensing the proximity of an object has a sensing element (X2A,X2B) and a signal conditioner (S8) produced from the same semiconductor wafer with the signal conditioner being positioned on one surface of the wafer and the sensing element being positioned on the side so that the sensing element is generally at right angles to the signal conditioner. The signal conditioner and sensing element are electrically interconnected via integrated conductive pads (4a-4d: 8a-8d) and conductive surface traces (2a-2d: 6a-6d). <IMAGE></p>
