发明名称 THERMOELECTRIC DEVICE AND THERMOELECTRIC MANIFOLD
摘要 <p>In a thermoelectric device such as a thermoelectric manifold having a plurality of stages of thermoelectric modules, not only are distributions of heat. at endothermic and exothermic surfaces equalized to increase the heat exchange efficiency and also to suppress thermal strains in the thermoelectric modules, but also heat transmission between the thermoelectric modules is facilitated even though bowing occurs. For this purpose, in the thermoelectric device utilizing the plural thermoelectric modules, a fluid serving as a heat transfer medium is intervened between the thermoelectric modules and is utilized to achieve a transmission of heat from the exothermic surface of the thermoelectric module on a cooling side to the endothermic surface of the thermoelectric module on a heating side. &lt;IMAGE&gt;</p>
申请公布号 EP1164340(A1) 申请公布日期 2001.12.19
申请号 EP20000909700 申请日期 2000.03.17
申请人 MATSUSHITA REFRIGERATION COMPANY 发明人 UETSUJI, TOSHIO;INAMORI, SYOUHEI;KIDO, OSAO;MORISHITA, KENICHI;FUJIMOTO, MASATSUGU
分类号 F25B21/02;(IPC1-7):F25B21/02 主分类号 F25B21/02
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