Processing system and method

摘要

A processing system is provided that includes a processing chamber, and a source of gas coupled to the processing chamber for supplying a gas thereto. A pump is located adjacent the processing chamber, and is coupled to the processing chamber for pumping the gas from the processing chamber. The processing system further includes a recycling line, coupled to the pump and adapted to cycle at least a portion of the gas pumped from the processing chamber back into the processing chamber. Methods for cleaning deposition chambers and for etching semiconductor substrates are also provided. <IMAGE>