发明名称 |
VERFAHREN ZUR BILDUNG METALLISCHER LEITERMUSTER AUF ELEKTRISCH ISOLIERENDEN UNTERLAGEN |
摘要 |
In order to form metallic conductor patterns having connection regions that can be soldered and/or bonded on electrically insulating substrates, firstly a metalization is applied to the substrate and is then removed again, at least in those regions adjoining the desired conductor pattern. There then follows the electrolytic deposition of a final surface which can be soldered and/or bonded to the connection regions. Clean-room conditions are not necessary. |
申请公布号 |
AT209846(T) |
申请公布日期 |
2001.12.15 |
申请号 |
AT19980914860T |
申请日期 |
1998.03.03 |
申请人 |
SIEMENS S.A. |
发明人 |
HEERMAN, MARCEL;DE STEUR, HUBERT |
分类号 |
H01L21/48;H05K3/00;H05K3/02;H05K3/08;H05K3/24;H05K3/28 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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