| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for bonding an electronic component capable of assuring a bonding quality by facilitating management of the worm amount of a bonding tool. SOLUTION: The method for bonding the electronic component for bonding the component by pressing with ultrasonic vibration comprises the steps of detecting a change of impedance of a vibrator 20 prior to bonding to detect a contact with a reference surface 3a, and detecting the worm amount of a bonding tool with a contact surface of the component from the detected result. At the bonding time, a pressing amount of a bonding head is controlled based on the detected result of the worm amount. Thus, the worm amount of the tool is easily detected, the component can be pressed to a work with a predetermined pressing force, and the bonding quality can be assured.
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