| 发明名称 |
BONDING METHOD AND DEVICE THEREOF |
| 摘要 |
PROBLEM TO BE SOLVED: To be able to press a bonding object with an appropriate load against a bonded substance and to improve the property of the bonding substance against the bonded object by the means. SOLUTION: A bonding means continuously increases and decreases a bonding load during the bonding. |
| 申请公布号 |
JP2001345341(A) |
申请公布日期 |
2001.12.14 |
| 申请号 |
JP20000163448 |
申请日期 |
2000.05.31 |
| 申请人 |
SHIBAURA MECHATRONICS CORP |
发明人 |
ARIE MAKOTO;UEMURA SATORU |
| 分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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