METHOD FOR IDENTIFYING DEFECTIVE ELEMENTS IN ARRAY MOLDING OF SEMICONDUCTOR PACKAGING

摘要

The present invention is a method for identifying defective elements in array molding of semiconductor packaging for mini BGA packaging substrate which comprises a circuit zone and a periphery zone. The method of the present invention is first to form a plurality of package sites disposed in array in the circuit zone, and to form a plurality of marks in a periphery zone. When a defective element is found in the package sites, a symbol is put at the mark or an electronic file is employed to record the location of the defective element, thereby, the defective element in the package sites of the molding array in the circuit zone can be identified.