| 发明名称 |
Polishing apparatus |
| 摘要 |
In a polishing apparatus having a cover body with fluid pressing mechanism, during polishing, vibration and migration of sticking portion between a retainer and a membrane generated in downstream of rotation of a polishing platen is prevented by reducing sticking force between the retainer and the membrane to less than force needed to wafer polishing with rotation of the cover body. |
| 申请公布号 |
US2001051500(A1) |
申请公布日期 |
2001.12.13 |
| 申请号 |
US20010811496 |
申请日期 |
2001.03.20 |
| 申请人 |
HOMMA YOSHIO;KONDO SEIICHI;SAKUMA NORIYUKI;YAMADA YOUHEI;KIMURA TAKESHI;NEZU HIROKI |
发明人 |
HOMMA YOSHIO;KONDO SEIICHI;SAKUMA NORIYUKI;YAMADA YOUHEI;KIMURA TAKESHI;NEZU HIROKI |
| 分类号 |
B24B37/00;B24B37/005;B24B37/04;B24B37/30;B24B37/32;H01L21/304;(IPC1-7):B24B5/00 |
主分类号 |
B24B37/00 |
| 代理机构 |
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