IC card module, manufacturing method therefor, hybrid integrated circuit module, and manufacturing method thereof

摘要

A support member 1 is previously molded, a hybrid integrated circuit substrate 45 is placed thereon, and the support member 1 on which the hybrid integrated circuit substrate 45 is placed is placed in a metal mold, then again molded of a thermoplastic resin 2. The poured high-temperature thermoplastic resin 2 strikes on the support member 1 whose bottom surface is directly contacted on the metal mold and the surface of the striking portion is melted and integrated without being deformed . Therefore, full mold substantially covering an entire surface of the substrate is enabled. Epoxy potting is applied to a semiconductor chip and a coil derivation part.