发明名称 MOLD CLAMPING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a mold clamping apparatus not relying on a mold on-off stroke, small in size and having a small projection area. SOLUTION: The mold clamping apparatus is constituted of a fixed die plate 2 to which a fixed mold 1 is attached, a support plate 4 on which a mold on-off drive source is mounted, a die set comprising a plurality of tie bars 5 trained over the fixed die plate 2 and the support plate 4, the movable intermediate plate 6 guided in the direction parallel to the tie bars 5, the movable die plate 8 arranged between the intermediate plate 6 and the fixed die plate 2 and having a movable mold 7 attached thereto, the toggle clamp 9 attached across the intermediate plate 6 and the movable die plate 8 to perform mold clamping and a lockup mechanism for fixing the intermediate plate 6 to the support plate 4 and the tie bars 5 at a point of time when the intermediate plate 6 comes to a dead point in a mold closing direction by the mold on-off drive source 3.
申请公布号 JP2001341181(A) 申请公布日期 2001.12.11
申请号 JP20000167656 申请日期 2000.06.05
申请人 TOKIN CORP 发明人 KAJITANI TOSHIO;SHIRAISHI MASAHIKO;IIDA TOMOHIRO
分类号 B22D17/26;B29C33/22;B29C45/66;B29C45/68;(IPC1-7):B29C45/66 主分类号 B22D17/26
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