| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor module of which cooling performance is improved by directly bringing a cooling fluid in contact with a semiconductor module substrate, and which is inexpensive and can meet a specification for cooling and fatigue durability by giving a controllability to the physical property of a heat radiating substrate. SOLUTION: This semiconductor module is provided with a plurality of semiconductor elements 102 joined with a heat radiating substrate 104 by means of an insulation substrate 103. The heat radiating substrate 104 is made of composite material of copper (Cu) and criprous oxide (Cu2O).</p> |
